Silver/carbon hybrid conductive ink and ink-curing unit use microwave-heat printing technology to form traces on flexible printed circuits. Uses selective microwave heating and novel Photonic Curing process for printing on low-heat-resistant plastic films and roll-to-roll continuous printing. Controls spark discharge by separating microwave’s magnetic field and electric field and applying the fields separately in heating. Uses novel silver/carbon hybrid conductive ink, in which carbon particles (which do not develop a phase change during heating) have been added to silver particles to ensure uniform curing of ink under microwave heating, preventing a nonuniform distribution of conductivity.

Showa Denko K.K. (SDK), www.sdk.co.jp

Sarcon GR25A-00-50GY soft thermal gap filler pad exhibits low thermal resistance. Is a thermally conductive silicone-based material that reportedly conforms to most component shapes and board protrusions. Exhibits low pressure. This 0.5mm thick TIM provides a thermal conductivity of 2.5 W/m°K and a thermal resistance as low as 0.18 °Cin²/W. Is available in pre-cut sheets up to a max. size of 200 x 300mm; can be die cut to application specifications.

Fujipoly America Corp., www.fujipoly.com