More than 500 SparkFun open source schematic and printed circuit board designs have been released on the Upverter cloud-based electrical engineering platform. Designs can be used as part of an existing design or to start a new project.
FloEFD concurrent computational fluid dynamics (CFD) software incorporates Monte-Carlo radiation modeling for thermo-optical performance, and advanced multicore meshing of complex geometries which permits faster simulation. Monte-Carlo radiation modeling is important for precise analysis of geometric effects in optics, such as the refraction and reflection of radiation absorptive media; for example, lens focusing. Provides a unique boundary layer treatment and, when combined with robust meshing capable of capturing highly complex geometries automatically, it enables accurate predict complex thermo-optic behavior. This is ideal for applications such as automobile lighting, consumer luminaire design, and video/photography-related products. Supports fluid-structure interaction through a mesh-based parallel code coupling interface bridge. Allows export of CFD analysis data for finite element analysis (FEA) in a wide range of popular structural simulation programs, thereby enabling users to conduct multi-disciplinary analyses. 0
TerraGreen halogen-free, ultra-low loss, RF/microwave/high-speed material is for power amplifier boards for 4G LTE base stations, internet infrastructure and cloud computing. Has a full offering of cores and prepreg utilizing spread-glass fabric. Dielectric constant (3.00 to 3.45) and dissipation factor (0.0030 to 0.0035) remain stable over a wide range of frequencies and temperatures. Core thicknesses from 0.002” to 0.018”, 0.020”, 0.030” and 0.060” are available. Is a lead-free assembly material with a short-lamination cycle. Is said to be easy to drill, does not require plasma desmear, and prepreg shelf life is similar to FR-4 materials. Is suitable for high-layer count, high-speed digital, backplanes and is compatible with Isola’s FR-4 materials for hybrid designs.
Direct Board Interconnect Technology (DBiT) process for terminating lead wires or flexible circuits directly on to a PCB eliminates connectors, while producing a high quality connection. Performs direct connection of wire, component lead, or flex circuit via a crimping system. Requires no soldering. Continuous-feed splicing material process.
EDABuilder 3.0 includes 3D STEP model automation; automates the library process flow. Can take advantage of a single data sheet input source for automation and verification between mechanical and electrical models. Has STEP format and schematic symbols, and exports PCB footprints to multiple EDA formats. PCB footprint automation is supported across component families, including all surface mount parts defined in IPC-7351, as well as through-hole parts; all have 3D model generation capabilities. Users enter PCB component dimensioning using IPC-7351 or recommended manufacturer dimensioning. Mechanical dimensioning is entered on the same forms and displayed on the front and side mechanical views. Automatically performs mapping and scaling based on the component type to an embedded 3D template. 3D STEP models can be imported directly into the mechanical design tools. Can be exported directly into Cadence Allegro and OrCAD PCB Editors with origins, offsets, and alignments automatically assigned. Imports symbol and footprint libraries from schematic and PCB editing tools.
