Silver/carbon hybrid conductive ink and ink-curing unit use microwave-heat printing technology to form traces on flexible printed circuits. Uses selective microwave heating and novel Photonic Curing process for printing on low-heat-resistant plastic films and roll-to-roll continuous printing. Controls spark discharge by separating microwave’s magnetic field and electric field and applying the fields separately in heating. Uses novel silver/carbon hybrid conductive ink, in which carbon particles (which do not develop a phase change during heating) have been added to silver particles to ensure uniform curing of ink under microwave heating, preventing a nonuniform distribution of conductivity.

Showa Denko K.K. (SDK), www.sdk.co.jp

Sarcon GR25A-00-50GY soft thermal gap filler pad exhibits low thermal resistance. Is a thermally conductive silicone-based material that reportedly conforms to most component shapes and board protrusions. Exhibits low pressure. This 0.5mm thick TIM provides a thermal conductivity of 2.5 W/m°K and a thermal resistance as low as 0.18 °Cin²/W. Is available in pre-cut sheets up to a max. size of 200 x 300mm; can be die cut to application specifications.

Fujipoly America Corp., www.fujipoly.com
 
 

RO4360G2 laminates reportedly have improved thermal reliability for higher UL max. operating temperatures. Have higher Dk of 6.15 @10GHz. Reportedly permit a 20-30% reduction in printed circuit board size. Reportedly process similar to FR-4 and are automated assembly compatible. UL 94V-0 flame rating pending; Pb-free process capable. Thermal conductivity is 0.81 W/m/K, Z-axis CTE is low, and drill performance similar to RO4350B.

Rogers Corp., www.rogerscorp.com

UDI-8001P direct imager is said to have a throughput of 35 sec. per panel and a resolution of ±5µm lines/spaces. Overlay accuracy is reportedly  ±5µm, with 600 alignment points. Processes ultra-fine-pitch flip-chip and BGA packages.

Ushio, www.ushio.co.jp/en