PCBTech R6000T inline printed circuit board depaneler handles boards up to 330 x 400mm, has an X、Y、A cutting speed of 0~100mm/s, and ±0.02mm repeatability. Cutting precision is ±0.1mm. Conveyor height is 900 ±50mm. Spindle rotational speed reaches 60000rpm max. Machine is 1300mm x 2150mm x 1700mm (height). Servo motors. Uses Windows 2007 OS.
More than 500 SparkFun open source schematic and printed circuit board designs have been released on the Upverter cloud-based electrical engineering platform. Designs can be used as part of an existing design or to start a new project.
FloEFD concurrent computational fluid dynamics (CFD) software incorporates Monte-Carlo radiation modeling for thermo-optical performance, and advanced multicore meshing of complex geometries which permits faster simulation. Monte-Carlo radiation modeling is important for precise analysis of geometric effects in optics, such as the refraction and reflection of radiation absorptive media; for example, lens focusing. Provides a unique boundary layer treatment and, when combined with robust meshing capable of capturing highly complex geometries automatically, it enables accurate predict complex thermo-optic behavior. This is ideal for applications such as automobile lighting, consumer luminaire design, and video/photography-related products. Supports fluid-structure interaction through a mesh-based parallel code coupling interface bridge. Allows export of CFD analysis data for finite element analysis (FEA) in a wide range of popular structural simulation programs, thereby enabling users to conduct multi-disciplinary analyses. 0
TerraGreen halogen-free, ultra-low loss, RF/microwave/high-speed material is for power amplifier boards for 4G LTE base stations, internet infrastructure and cloud computing. Has a full offering of cores and prepreg utilizing spread-glass fabric. Dielectric constant (3.00 to 3.45) and dissipation factor (0.0030 to 0.0035) remain stable over a wide range of frequencies and temperatures. Core thicknesses from 0.002” to 0.018”, 0.020”, 0.030” and 0.060” are available. Is a lead-free assembly material with a short-lamination cycle. Is said to be easy to drill, does not require plasma desmear, and prepreg shelf life is similar to FR-4 materials. Is suitable for high-layer count, high-speed digital, backplanes and is compatible with Isola’s FR-4 materials for hybrid designs.
Direct Board Interconnect Technology (DBiT) process for terminating lead wires or flexible circuits directly on to a PCB eliminates connectors, while producing a high quality connection. Performs direct connection of wire, component lead, or flex circuit via a crimping system. Requires no soldering. Continuous-feed splicing material process.
