CST Studio Suite 2014 includes a palette of high-frequency and low-frequency solvers; provides technology for applications such as printed circuit boards, cables and charged particle devices. Can import, manipulate and export models from CAD and EDA software. System Assembly and Modeling tool allows multiple full-wave 3D and circuit simulations to be combined into a series of tasks to be carried out automatically. Simplifies multiphysics workflows, has more PCB functionality, and support for nearfield sources in the frequency-domain and integral equation solvers. Transient and frequency-domain solvers support new meshing techniques for tetrahedral and hexahedral meshes. Includes improved CAD export; version control for CAD data; sub-volume field monitors; MWS transient solver; time-averaged power loss monitor; combined CPU-GPU computing; MWS frequency domain solver; MWS integral equation solver; MWS asymptotic solver; enhanced EDA import tools; decoupling capacitor optimization; transient spectrum extraction with AC Task, and faster MOR and Transient Task.

Computer Simulation Technology, http://www.cst.com

Multisim 13.0 SPICE simulation environment is for circuit parameter and parameter sweep analysis. Features include digital circuits education using NI myRIO and Digilent FPGA targets; power electronics analysis with IGBT and MOSFET thermal models; device simulation for 26,000+ devices; design automation with the NI LabVIEW Multisim API Toolkit. Offers circuit analysis tools for analog, digital and power electronics. Includes courseware and lab hardware integration to NI myDAQ, NI ELVIS, NI myRIO and digital products from Digilent. Has ready-to-use daughterboard templates.

National Instruments, www.ni.com

TC-2030 and TC-2035 thermally conductive adhesives were developed to enable design of more compact, reliable and higher performing automotive electronics assemblies. Are two-part, heat-cured silicone technologies. TC-2030 has a thermal conductivity of 2.7 W/mK. Reportedly provides improvement in elongation performance. Has bond line thickness of 130µm. TC-2035 helps manage heat in automotive applications, including power electronics. Has 3.3 W/mK thermal conductivity and BLT as low as 50µm. Bonds to thermal substrates, including direct bonding copper, high-density interconnect, low-temperature co-fired ceramic and printed circuit boards. Sustains performance at temperatures reaching 200°C.

Dow Corning, www.dowcorning.com
 

BluePrint-PCB v. 3.6 software integrates BluePrint-PCB and Cadence OrCAD PCB Designer and Allegro PCB Layout tools. Integration automates the PCB documentation process for Cadence tools and eliminates all manual file transfer between applications. Automatically extracts and loads OrCAD and Allegro data. Works with new and existing PCB layouts. Automatically updates documentation packages created through the integration. Creates or updates existing documents directly from Allegro PCB Design System menus. EDA data transfer occurs automatically in the background. Sets hatch patterns for copper on PCB CAD layers, displays IPC standard annotation labels denoting the flip (mirror) status, displays process step filtered by an assembly variant in an assembly PCB view or process step chart. Sets drill symbol size for each hole size.

DownStream Technologies, www.downstreamtech.com