Cupracid AC conformal plating process permits high throwing power in BMV’s and through-holes at high current density. Provides a uniform surface distribution leading to a reduced plated copper thickness of about 3μm. Is a DC (direct current) process for high volume using vertical conveyorized line/plating and sparger electrolyte agitation. Permits conformal copper plating with soluble anodes in DC mode. All additives can be controlled using CVS (cyclic voltammetric stripping). May also be used with air agitation in hoist type equipment. In tests, a plating time of 60 min. and a current density of 3 A/dm², the throwing power of a 1.2mm thick panel with hole diameters of 0.3/0.25mm showed >95% min throwing power at 0.3mm and >90% min at 0.25mm.

Atotech, www.atotech.com

Ansys 15.0 simulation software optimizes product designs for structures, fluids and electromagnetics. Enables multiphysics workflows for simulation practices. Enhancements feature the capability for studying turbomachinery flow paths; in electromagnetic, it offers an electric motor design process. Can mesh model size and complexity. Reportedly speeds performance by a factor of five. Extends evaluation of product performance of composites materials. Facilitates submodeling techniques in pre-processing workflow. Introduces multiphysics approach to composites simulation to optimize wireless design and thermal management. Defines spatially dependent material properties for electromagnetic simulation and then couples results to the structural analysis. Features include improved performance with new solvers; bolt thread modeling as a contact; multiple finite element models that can be assembled.

Ansys, www.ansys.com/ansys15.0

E³.EDM Data Management Solution manages E³.series design data in its native format. Builds on Zuken’s E³.series and Contact Software’s CIM Database EDM platform to provide data and process management integrated into E³.series for wire, harness, cable, control system and fluid design.

Sarcon 25GR-T2d thermal interface material is conformable gap filler pad with a reinforced mesh center. Is for applications that require a thermal interface bridge across larger surface areas. Is reportedly an alternative to thin films when it is not possible to exert a large amount of force between the heat spreader, housing, PCB and heat sink. Is 0.25mm thick; delivers a thermal conductivity of 1.5 W/m°K and a thermal resistance of 0.40°Cin²/W at 43.5 psi. Is recommended for applications with operational temperatures between -40°C and +150°C. Can be ordered in 10m rolls or pre-cut sheets up to a max size of 200mm x 300mm.

Fujipoly America Corp., http://www.fujipoly.com