DFMStream v. 11 introduces more than 70 additional DFM analysis checks to support the printed circuit board fabrication and assembly processes.

Analysis expansion was designed to satisfy requirements for advanced vias, back drilling, fine pitch SMD components, tighter tolerances for solder and paste masks and other technologies. Designs with advanced via types can be analyzed for minimum clearances to specific via types: Pads and traces can be analyzed for adjacency to laser vias independent of blind or buried vias and other advanced design constructs; paste mask can be assessed as a ratio of pad area coverage; drill depth can be assessed as a ratio of board thickness. Can add design intelligence to Gerber and NC files by assigning Gerber/drill elements properties such as laser via, blind and buried via, back drill, and so on. DFM analysis capability is available as an upgrade to existing CAM350 installed base.

DownStream Technologies, www.downstreamtech.com

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