Altium Designer 14 is a 3D printed circuit board design system. Now features support for flex and rigid-flex design, including schematic capture, 3D PCB layout, analysis and programmable design; includes advanced layer stack management. Provides support for embedded PCB components. Reportedly simplifies high-speed design rules, including automated and guided adjustment of differential pair width-gap settings. Includes via-stitching improvements; can constrain via-stitching pattern to a user-defined area. Has an importer for CadSoft Eagle and support for transfer of designs to and from AutoCAD *.DWG and *.DXF formats; supports latest versions of AutoCAD.
Altium Ltd., www.altium.com
JOT Router is an inline router for automated depaneling of printed circuit boards used in mobile phones, smartphones, tablet computers, PCs and computers, motherboards, or automotive electronics. Has a modular system architecture. Consists of a cutting unit, available as single or dual spindle. Is also available with options for material out feeding, including a tray feeder and flat belt conveyer. Provides automatic tray handling. Product alignment and cutting accuracy are verified by machine vision system. Includes a dust exhaust system and an adjustable dual spindle with motorized height adjustment.
JOT Automation, www.jotautomation.com
Spectre XPS (eXtensive Partitioning Simulator) is a FastSPICE simulator that enables simulation for large, complex chip designs.
CST Studio Suite 2014 includes a palette of high-frequency and low-frequency solvers; provides technology for applications such as printed circuit boards, cables and charged particle devices. Can import, manipulate and export models from CAD and EDA software. System Assembly and Modeling tool allows multiple full-wave 3D and circuit simulations to be combined into a series of tasks to be carried out automatically. Simplifies multiphysics workflows, has more PCB functionality, and support for nearfield sources in the frequency-domain and integral equation solvers. Transient and frequency-domain solvers support new meshing techniques for tetrahedral and hexahedral meshes. Includes improved CAD export; version control for CAD data; sub-volume field monitors; MWS transient solver; time-averaged power loss monitor; combined CPU-GPU computing; MWS frequency domain solver; MWS integral equation solver; MWS asymptotic solver; enhanced EDA import tools; decoupling capacitor optimization; transient spectrum extraction with AC Task, and faster MOR and Transient Task.
Computer Simulation Technology, http://www.cst.com
Multisim 13.0 SPICE simulation environment is for circuit parameter and parameter sweep analysis. Features include digital circuits education using NI myRIO and Digilent FPGA targets; power electronics analysis with IGBT and MOSFET thermal models; device simulation for 26,000+ devices; design automation with the NI LabVIEW Multisim API Toolkit. Offers circuit analysis tools for analog, digital and power electronics. Includes courseware and lab hardware integration to NI myDAQ, NI ELVIS, NI myRIO and digital products from Digilent. Has ready-to-use daughterboard templates.
National Instruments, www.ni.com
TC-2030 and TC-2035 thermally conductive adhesives were developed to enable design of more compact, reliable and higher performing automotive electronics assemblies. Are two-part, heat-cured silicone technologies. TC-2030 has a thermal conductivity of 2.7 W/mK. Reportedly provides improvement in elongation performance. Has bond line thickness of 130µm. TC-2035 helps manage heat in automotive applications, including power electronics. Has 3.3 W/mK thermal conductivity and BLT as low as 50µm. Bonds to thermal substrates, including direct bonding copper, high-density interconnect, low-temperature co-fired ceramic and printed circuit boards. Sustains performance at temperatures reaching 200°C.
Dow Corning, www.dowcorning.com