XpeditionPCB layout platform, the first announced phase of the new Xpedition flow, addresses placement planning for performance and reuse; efficient routing of complex, dense topologies; and electromechanical optimization. Features Sketch Router, an auto-assisted routing process said to deliver hand-routed-quality indramatically less time.

TechniEtch 1688 organic acid-based copper microetch chemistry is for polymer coating. Reportedly improves yields of fine features with plating resists, etch resists or solder mask; handles conditions like HASL, ENIG, and immersion tin. Provides uniform copper surface appearance for AOI detection. Reportedly removes less copper off printed circuit board; holds more copper in etch solution. 

Technic Inc., www.technic.com

Altium Vault 1.2 adds the ability to migrate data from one vault to another, and enhanced support for connecting to corporate enterprise systems, such as ERP and PLM. Can be hosted on an organization's own network infrastructure. Permits traceability and "where-used" Information through disciplined revisioning. Shortens design cycles through design reuse. Is said to reduce risk through smart supply chain intelligence during design time, not after where it is most costly. New Team Configuration Center (TC2) centralizes and standardizes design environment, from design tool setup and configuration to document templates and manufacturing file formats, which can be set up and automatically deployed to each engineer’s desktop.

Altium, www.altium.com

Cupracid AC conformal plating process permits high throwing power in BMV’s and through-holes at high current density. Provides a uniform surface distribution leading to a reduced plated copper thickness of about 3μm. Is a DC (direct current) process for high volume using vertical conveyorized line/plating and sparger electrolyte agitation. Permits conformal copper plating with soluble anodes in DC mode. All additives can be controlled using CVS (cyclic voltammetric stripping). May also be used with air agitation in hoist type equipment. In tests, a plating time of 60 min. and a current density of 3 A/dm², the throwing power of a 1.2mm thick panel with hole diameters of 0.3/0.25mm showed >95% min throwing power at 0.3mm and >90% min at 0.25mm.

Atotech, www.atotech.com