Nikram ultra-thin microwave absorption film suppresses noise from high frequency devices up to 12GHz. Is 42.5 microns thick film and effectively absorbs microwaves and does not require grounding like most traditional shielding. The suppression rate of the microwaves absorbed is 30dB at 4GHz and is stable for frequencies greater than 4GHz. Is said to reduce incoming noises, outgoing noises and reflective noises from high-frequency devices simply by attaching it on the surface of any housing without any grounding requirements.
DKN Research, www.dknresearchllc.com
Nikkan Industries, http://www.nikkan-ind.co.jp/en/develop/laminate.html
Supplier Quality Engineering audit enables identification of printed circuit boards coated with Entek organic solderability preservatives. Includes OSP verification, process line optimization, and consultation on other PCB final finish options based on application requirements. A composition analysis of the OSP-coated PCB is employed to confirm Entek OSP is being used by OEM. Review of PCB fabricator’s OSP process line, including chemistry (cleaning, topography enhancement, pre-coat, OSP), equipment, and operating parameters, is undertaken.
Enthone, www.enthone.com
Ex1 is a desktop 3D printer of print circuit boards. Uses a two-part printing process based on inkjet technology to deposit two different chemicals, one on top of the other. Resulting chemical action leaves a trace made out of silver that is reportedly flexible and conductive. Is capable of printing on wood, paper, kapton tape, glass, fr4, and fabric.
Cartesian Co., www.cartesianco.com
Vertrel Sion cleaner is for vapor degreasing of electronics and other surfaces. Complies with REACH, F-gas regulations, and other environmental regulations. Is classified as a hydrofluorolefin (HFO) solvent; is nonflammable and ozone-safe. Reportedly does not require acid testing, stabilizer maintenance or solvent monitoring. Does not contain surfactants. Cleans blind vias and flushes underneath BGAs.
DuPont, www.dupont.com
PallaBond direct palladium surface finish process, with optional gold layer, permits direct deposition of palladium on copper, without using nickel. Is suitable for key press, high-frequency, flexible PCB gold, aluminum and copper wire-bonding applications. Is said to provide superior solder joint strength for lead-free and eutectic SnPb solder and is compatible with many new base materials and soldermask types. Operates at a thickness of less than 300nm, for fine lines and spaces. Is free of thiourea, lead and nickel.
Atotech, www.atotech.com