Gold-Tin Plating deposits can be selectively applied for interconnecting RF and microwave components, lead frames and other miniature parts on high-frequency PCBs.

InCa3D version 2.3  tool for conducter impedance and near field simulation now imports Gerber PCB CAD files, and reads both layers and vias.

MXA signal analyzer now features improved sensitivity and higher frequency stability and coverage. 

JT 2147/VPC is signal conditional module; is a JTAG/boundary-scan hardware interface product compatible with Virginia Panel mass interconnect system.