K7000 singulates thin pre-scored panels with close component spacing. Is said to safely depanelize boards as thin as 0.020”.

DiPaMat Wh03 UV-curable legend ink features improved whiteness, adhesion and pencil hardness. Ink is RoHS-compatible. Contains no VOCs and is not toxic. Replaces Wh02.

Agfa, www.agfa.com

Integr8tor v7.1 is the latest version of a sales and engineering server for auto input and design analysis. Enables quotes in minutes. Reportedly increases CAM throughput by up to 30%, and supports frontend engineering. Automatically downloads and analyzes incoming design data, including design breakdowns with design-rule, DfM and capability checks. Addresses process and DfM issues such as drill span clearance and drill sequencing, and flags where holes will be drilled in SMT pads. Provides data such as minimum hole-to-hole clearance for inner layers, as well as extended XML information, the number of testable nets available, and minimum line widths on full planes and multiple paths.

Ucamco, www.ucamco.com

MCL-E-800G/MCL-E-705G series semiconductor package substrate materials are halogen-free, high Tg, low thermal expansion. 800G series has a CTE of 2.8ppm/℃, and is for use in package-o-package (PoP) and FC-BGA interposer substrates. MCL-E-705G series is suitable for multi-tiered structures such as stacked semiconductor packages.

Hitachi Chemical, www.hitachi-chem.co.jp/english/index.html