Material Selection for High-Speed PCBs
Consider return loss and insertion loss – but don’t stop there. READ MORE...
Characterizing Etchback and Dielectric Loss Tangent
Fabrication-aware simulations to aid PCB design success. READ MORE...
Sequential Lamination in PCB Manufacturing
Manufacturing high-layer count boards. READ MORE...
Implementing Flash Memory in PCB Design
Routing flash has EMI implications. READ MORE...
Flex Shock and Vibration
PSAs and carefully chosen connectors can reduce the shock of intense conditions. READ MORE...
Homepage Slideshow
Consider return loss and insertion loss – but don’t stop there.
https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18654-what-is-the-best-material-for-a-high-speed-pcb
Fabrication-aware simulations to aid PCB design success.
https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18652-characterizing-etchback-and-dielectric-loss-tangent
Manufacturing high-layer count boards.
https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18653-sequential-lamination-in-pcb-manufacturing
Routing flash has EMI implications.
https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18648-implementing-flash-memory-in-pcb-design
PSAs and carefully chosen connectors can reduce the shock of intense conditions.
https://www.pcdandf.com/pcdesign/index.php/current-issue/243-flexperts/18651-flex-shock-and-vibration
Printed Circuit Design & Fab Magazine
Drill sizes from 0.008" to 0.250", with a tolerance of +/-0.005", are now available on a quickturn basis. Smaller vias are now possible on two-layer boards. No special changes to files needed.
Sunstone Circuits, www.sunstone.com
View the DigitalEdition Here!