FEATURES

A new alternative using QFNs with open thermal via-in-pad (VIP) structures reduces cost and eliminates solder wicking.

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The last edition of DKN’s newsletter focused on the market conditions in Taiwan.

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One down, on to the next! The second major Japanese electronics event of the year was held at Tokyo Big Sight starting Jan. 27.

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As smart integrated technology connected to the internet becomes mainstream across the consumables industry, complex design challenges are no longer limited to the elite innovating companies, but spread to the far reaches of manufacturers which juggle the trade-off between function vs. cost and competitive forces.

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InterNepcon Japan 2016 is the first electronics trade show in Japan this year.

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Enabled by superior materials, a host of passives have greater electrical benefits in even smaller packages.

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