Processes and tools for accurate lab analysis and defect detection.

Electronic sample preparation is a complex process that goes beyond merely lopping a piece off a PCB for inspection. This process involves several, exacting preparation stages.

The process designs each step to specifically adapt to the inspected device’s design, materials, and fabrication technology. Performing any of the preparation stages incorrectly can result in spurious features, artifacts and great potential for both Type I and Type II error.

The process starts with PCB manufacturers designing test coupon segments into each of their products. This function enables panel testing without wasting the actual production board. To confirm the lab has met product specifications, they separate the coupon from each panel.

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A look back at friends and colleagues who left us in 2020.

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Latest IPC-DPMX standard offers unique bidirectional data exchange between design houses and their manufacturing partners.

The authors of IPC-DPMX, previously known as IPC-2581, have come up with an innovative solution for addressing the needs of the industry for the latest version of the electronics data transfer standard. Developed for the industry by the industry, IPC-DPMX has many new enhancements. The just-released Revision C has been reviewed and unanimously approved by the PCB design, analysis and supply chain industry.

IPC-2581B introduced the concept of bidirectional data exchange between design houses and their manufacturing partners. It sought to eliminate the back-and-forth between partners at the very end of the design cycle for communicating and ensuring that critical net impedances were achievable. This communication was important earlier in the design cycle and impacted the layer stack-up, which is very hard to change at the end once design is complete and handed off. Although this innovation was unveiled almost seven years ago, it is still unmatched and unique within an open standard.

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As chiplet usage increases, chip-level concerns shift into the area of system-in-package implementation. Therefore, the system-in-package (SiP) must now accommodate electrical performance and cost considerations. A rapid prototyping tool flow that allows the engineering team to make quick assessments of these goals is essential.