PACKAGING
Cost/Benefit Tradeoffs of Capacitor Part Size vs. Manufacturing Efficiency
Passives continue to eat up 70% of the board area. How smaller part sizes require less solder and can eliminate parasitic inductance.
by Chris Reynolds
COMPONENT PROCESSING
Embedded Passive Technology Materials, Design and Process
EPT can simplify assembly and test processes and reduce the actual cost, especially when using 0201 packages or lead-free processes. A summary of resistor material selection, evaluations and duplication of a complex digital design.
by Hikmat Chammas
CAVEAT LECTOR
Is sharing for suckers?
Mike Buetow
ROI
What’s hot this year?
Peter Bigelow
FOCUS ON BUSINESS
Governed solutions?
Joseph Fama