February 2009 PCD&F digital edition


PCDF February 2009 cover


Embedded Active Components In Multilayer LCP Packages
Embedded active technology offers advantages in reduced parasitics and form factors, but thermal dissipation and rework issues are delaying commercialization.
by Swapan K. Bhattacharya, Nickolas Kingsley, Chad Patterson and
John Papapolymerou

HS Simulation
Simulation: The Need for Speed
Establishing selection criteria can help determine the best simulation model for a specific task.
by Timothy Coyle

Material Registration
Advanced Registration Systems
An integrated registration control system can provide feedback for continuous improvement, increasing overall process yields.
by Neil Chilton

The DC Design Squeeze
DC simulations can help meet tight voltage margins and avoid field failure risk.
by Leslie Landers and Tanit Virutchapunt

Layout Tools
Do You Really Want a Better Autorouter?
Complex constraints require integrated autorouting that gives the designer the control to deliver productivity gains.
by Rob Irwin

Thermal Management
Designing With Conductive Materials, Part 1
Complex electronic products present design engineers with an increased need for cost-effective thermal management.
by Helena Li



Our Line
Consensus management.
Kathy Nargi-Toth

Making difficult decisions can help your company rise to the top during the economic storm.
Peter Bigelow

Tip Jar
Planning via placement can improve the routability and integrity of the PCB.
Susy Webb

BGA Bulletin
A look back at the most important ideas for fanout and routing of BGAs.
Charles Pfeil

Interconnect Strategies
PCB material selection requires the evaluation of electrical, mechanical and thermal properties, as well as price.
Dr. Abe (Abbas) Riazi

Final Finish Forum
Organic metals take the stage.
Jim Kenny

Defects Database
Thermal shock testing can avoid plating adhesion problems.
Dr. Davide Di Maio

On the Forefront
The right investments will prepare companies for tomorrow.
E. Jan Vardaman





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