2008 Issues

Increasing the thermal conductivity of the base materials improves thermal management in RF designs.

Read more: Thermally Conductive Microwave Materials

The assembly drawing should specify process-related issues.

Read more: Eliminating Board Defects

PCB design bottlenecks are reduced using customized tools.

Read more: Improve PCB Layout With Skill Utility Programs

Reliable lead-free assemblies require a collaborative approach that optimizes the PCB design along with specific base materials and known fabrication processes.

Read more: PCB Dielectric Degradation in Lead-Free Assembly Applications

Can 75,000 people in one place be environmentally friendly?

Read more: A Tale of Two Trade Shows
Kathy Nargi-Toth Read more: Defining 'Green'

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