2008 Issues

Dr. Bruce Archambeault

Read more: EMI/EMC and SI Effects from Ground-Return Vias on PCBs

When integrating FPGAs into PCB design every signal and pin has a measureable effect on production yield.

Read more: FPGA/PCB Co-Design Increases Fabrication Yields

Embedded capacitance frees up the board surface for routing traces, can reduce the overall board size and can speed time to market.

Read more: Implementation of Buried Capacitance in High-Speed Designs

Multiple lamination cycles add cumulative thermal stress to the innerlayer bonds.

Read more: Improved Innerlayer Bonding for Sequential Lamination
Kathy Nargi-Toth Read more: Waste Not, Want Not

Dynamic new co-design strategies will give the PCB designer the flexibility to re-map legacy package pinouts.

Read more: Improving Circuit Design Using IC Package/PCB Co-Design Techniques

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