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Written by Dr. Bruce Archambeault
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Category: 2008 Issues
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Read more: EMI/EMC and SI Effects from Ground-Return Vias on PCBs
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Written by Yan Killy
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Category: 2008 Issues
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When integrating FPGAs into PCB design every signal and pin has a measureable effect on production yield.
Read more: FPGA/PCB Co-Design Increases Fabrication Yields
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Written by Jun Fan, Norm Smith, Jim Knighten, John Andresakis, Yoshi Fukawa and Mark Harvey
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Category: 2008 Issues
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Embedded capacitance frees up the board surface for routing traces,
can reduce the overall board size and can speed time to market.
Read more: Implementation of Buried Capacitance in High-Speed Designs
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Written by Dr. Jean Rasmussen, Dr. Abayomi I. Owei, Danis Isik, Dr. Axel Dombert, and David Ormerod
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Category: 2008 Issues
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Multiple lamination cycles add cumulative thermal stress to the innerlayer bonds.
Read more: Improved Innerlayer Bonding for Sequential Lamination
