Ultrathin 40 micron laminate is glass-reinforced and does not have thermo-mechanical mismatch issues commonly associated with unreinforced films. Has a glass-transition temperature (Tg), above 170C. Young's modulus (Tensile Modulus) and thermal expansion coefficient are said to be similar to high-Tg systems.
Isola Group, www.isola-group.com
Circuit Foil, www.circuitfoil.com
N6800-22 has a dissipation factor (Df) of 0.0055 at 10GHz and 50% resin content using open resonator testing methodology. N6800-22 SI has a Df of 0.0040 at 10GHz and 50% RC using open resonator testing methodology. Permit high-signal speed transfers and reduced transmission loss. Designed for multiple high temperature lead-free assemblies and high layer count printed circuit board designs. Are CAF-resistant, high Tg materials with low Z-axis expansion. UL 94V-0, meet IPC-4101/91 specifications, RoHS compliant. Available in both prepreg and laminate forms.
Park Electrochemical, www.parkelectro.com
ProtoLaser U3 UV laser can cut or depanel nearly any substrate material; is for drilling, marking, depth engraving and surface etching of circuitry directly onto FR-4, ceramic or any other high-frequency RF substrate.
TestWay Express software provides an integrated workflow for DfT and test coverage analysis from design through product delivery. Analyzes each stage of the design to delivery workflow. Verifies optimum electrical DfT requirements and maximum test coverage; optimizes test probe placement according to test strategy definitions, estimates test coverage and cost modeling, calculates production yield and TL9000 initial return rates; verifies mechanical rules, allocates test probes and estimates test coverage based on actual physical access; generates test programs, or input lists and test models, as well as test fixture files. Estimates test coverage using theoretical models for a range of test and inspection strategies, including automated placement machines, AOI, AXI, boundary scan test, flying probe test, ICT and functional test. Can read completed test program or test report and compare the coverage between the estimated and measured analysis.
Aster Technologies, www.aster-ingenierie.com/
MagnaBond OxAlt is a three-part microetch additive said to promote mechanical copper-epoxy bonding by optimizing the copper substrate topography.
Multi-Cavity Slot-Lok Pro Shield reduces RFI/EMI emissions and elevates cross-talk between components. Uses standardized manufacturing methods to create multi-cavity solutions with minimal nonrecurring engineering charges and virtually limitless customization options. Is constructed from a solid, RoHS-compliant frame and a removable high-retention cover. Can combine multiple shields under the same footprint. Two-piece frame and removable cover construction facilitate rework and inspection processes. Offers up to 60 dB of shielding effectiveness; shields are installed using through-hole or surface mount soldering.
Leader Tech, www.leadertechinc.com