Printed Circuit Design & Fab Online Magazine - Products

New Products

A7Cf flying probe double-sided test system features four probes on top and four probes on the bottom. Performs up to140 measurements per sec. or up to 8,400 per min., depending on the product under test and test method. Features a test area of 20" x 24"; can inspect pad sizes down to 0.0002µm (0.00013µm with micro needle) and pitches down to 0.0004µm (0.0003µm with micro needle). Universal shuttle system offers a clamp and tension mode for testing flexible and rigid boards. Provides high-speed Kelvin 4-wire measurement; features direct linear drives and a carbon fiber Z-axis.

atg-LM, www.atg-lm.com

Sherlock V2.4 automated design analysis software has an improved parts database; can build and update local database in real time. Two new modules are available: DFMEA and ICT. Sherlock DFMEA modernizes component-level design failure mode effects analysis by automating the process of entering all pin-to-pin interactions. Spreadsheets with thousands of lines can be generated in seconds. Is compliant with AIAG and SAEJ1739 standards for DFMEA.

DfR Solutions, www.dfrsolutions.com

These four test points are optimized for use in single- and double-sided PCBs. Pins fit a 1mm hole; are used to afford secure attachment of scope probes and flying leads for test and measurement purposes. Smallest bottom entry version has a tin finish and provides a plain 6mm pin; the three larger sizes, with a gold finish, are designed for top entry. Are available as a single turret 3.5mm tall, an extended 11mm height turret, and with dual 5.4mm and 3mm turrets. Are RoHS compliant and lead-free.

E-Mark, www.e-markinc.com

UTF Connector FTF Series for fine-pitch connections between high-density flexible circuits is said to provide a range of design flexibilities for packaging and termination in portable electronics products.

Read more: DKN Research Releases UTF Connector FTF Series

Novagard 800-230, 800-305, and 800-400 UV curable staking compounds are used as conformal coatings, potting compounds, inks, encapsulating and gasketing compounds and gels. UV 800-230 fast UV curing, single-component sealant is solvent-free; exhibits controlled rheology, no oxygen inhibition, has no corrosive byproducts, and cures quickly to solid rubber with UV irradiation at room temperature. UV 800-305 UV/dual cure sealant and adhesive is a noncorrosive, single-component silicone translucent paste sealant; cures to a solid rubber at room temperature. Exhibits controlled rheology and no oxygen inhibition. RTV 800-400 UV cure sealant is a noncorrosive, single-component silicone translucent paste sealant.

Novagard Solutions, www.novagard.com

NeoScale high-speed interconnect reportedly achieves signal integrity at 28+ Gbps data rates. For printed circuit board mezzanine applications in enterprise networking towers and telecommunication hubs and servers. Features triad wafer configuration that isolates each differential pair. Comprises three pins per differential pair: two signal pins and one shielded ground pin. Each triad is a standalone 28 Gbps differential pair with no additional ground pins required. Honeycomb construction routes each triad to minimize crosstalk and route out of the PCB in one or two layers. Tombstone structures located in the connector housing protect the mating interface and flexible contacts. Featuring a density of 82 differential pairs per sq. in., the layout can be customized with high-speed differential pairs, high-speed single-ended traces, low-speed single-ended lines and power contacts. Available with 85 and 100 Ohm impedance and mated stack height range of 12 to 40mm. Design options include 6 to 30 circuit column sizes with 2, 4, 6 and 8 row options available, ranging from 12 to 240 triads in one assembly. Plug assembly features a 2.80mm pitch between differential pairs.

Molex, www.molex.com