Printed Circuit Design & Fab Online Magazine - Products

New Products

Arduino Prototyping Shield for surface mount prototyping use novel "EZ" soldering technology for fast and easy soldering.

Read more: SchmartBoard Debuts Arduino Prototyping Shields

Microcopper ink material is based on micron copper particles for direct printing of electronic circuits for mobile devices, solar cells, display devices, etc. Is designed to replace silver-based conductors. Is applied on substrates by additive print processes such as screen, flexographic and gravure printing, as well as dispensing techniques. Is compatible with photosintering curing processes and equipment-enabling printed trace conductors on substrates with max. temperature limitations. Can be used as a patterned seed layer for electroplating and metal finishing.

Applied Nanotech Holdings, www.appliednanotech.net

CR-5000 v. 14 PCB and IC package design software features a number of productivity enhancements for collaboration in FPGA development and for high-speed design.

Read more: Zuken Releases CR-5000 v. 14

Genesis 2000 version 9.9b and GenFlex version 2.9b have new interactive editing tools and a new job repair function that detects and repairs damaged jobs. Deliver enhancements to existing editor functionality and DFM actions, including sliver repair, drill checks and microvia checks. Genesis 2000 9.9b highlights: convert any feature to outline (e.g. slot to outline for rout) in several options; feature to outline conversion; split features to divide a feature into two and work on each part separately; split features by line reference; convert layer polarity; original layer (positive) and inverted layer (negative); apply a resize or offset transformation to a profile without converting the profile back to a layer; space tracks evenly from the middle of the bus; drill map creation, and sliver repair. GenFlex 2.9 features: automatic tooling holes placement and rigid/flex checks enhancements.

Frontline Solutions, www.frontline-pcb.com

LabVIEW FPGA IP Builder add-on uses Xilinx Vivado High-Level Synthesis technology to simplify high-performance field-programmable gate array (FPGA) algorithm design. Enhances productivity by reducing need for manual optimization of high-performance algorithms. When functional behavior and design constraints are specified, automatically generates a hardware implementation to meet requirements. Integrates with LabVIEW and the LabVIEW DSP Design Module. Features include increased FPGA design abstraction for enhanced productivity, improved algorithm performance and resource utilization, separation of code and design constraints facilitates IP reuse, seamless deployment to NI FPGA-based devices.

National Instruments, www.ni.com

Specialty conductive inks can be printed onto flat plastic substrate films using conventional screen, gravure or pad printing techniques. After drying, the plastic film can then be formed into shape using heat and pressure, and the printed conductive ink traces will follow the contour of the molded part. Even with sharp bends and deep draw sections in the molded part, the conductive ink traces will maintain conductivity. Electronic circuits fit easily into molded parts without the additional step of attaching a circuit to a molded part.

Conductive Compounds, http://www.conductivecompounds.com