DipTrace 2.3 fully functional printed circuit board design package features online design rules check, VRML 2.0 3D export, custom non-signal layers as well as advances in hierarchy, file compatibility, working speed and more.
Studio Suite simulation software has undergone a major redesign. A project wizard helps setup the software to meet a particular application type’s requirements and provide relevant results. This configuration can be modified by the user based on the experience gathered on-site to deal with the specific application characteristics. The modified configuration can be stored and reused easily. The user interface now not only groups features and menus, it also guides the engineer through the simulation process, only showing the currently active or relevant options. CST Microwave transient solver benefits from a quicker matrix set-up, the solver runs faster employing the latest Intel technology, and is able to deal with larger problems.
Highlights include: o Ribbon based user interface o Project wizard o Automatic storage of parametric results o Cylinder scan for farfields of all solvers
CST MWS transient solver o Faster, more memory efficient mesh generation o Kernel optimized for latest processor generation o Non-linear, frequency dependent materials, for example Kerr and Raman materials o More than 2 billion mesh cells o GPU acceleration for TLM solver
CST MWS frequency domain solvers o Curved tetrahedrons now default o Improved mesh set-up o Improved performance and memory efficiency o Efficient Eigenmode-solver for lossy dielectrics
CST MWS asymptotic solver o Range profiles for RCS
CST Design Studio o Improved automation for model set-up and result creation
HyperLynx DRC performs design rule checking on printed circuit board layout databases. Driven by customizable rules, it can be executed during the PCB layout process to highlight potential high-speed design issues pertaining to signal integrity, power integrity, and electromagnetic interference. Comes with a standard set of coded rules targeted at PCB layout practices that have the potential to cause issues common in high-speed design. Standard rules are parametrically driven so users can customize them. Samples of such issues include traces crossing plane splits, reference plane changes, nets near board edges, coupling to I/O nets, long interconnects, termination checks, impedance variations, crosstalk coupling, power net width, and decoupling cap proximity. Permits rule creation using VBScript and/or Javascript. Is interfaced with all major PCB layout tools, including Mentor’s Expedition Enterprise, Board Station and PADSR, Cadence Allegro, and Zuken CR.
SPF 1000 and SPF 1500 plasma systems deliver volume production capability for applying novel Semblant Plasma Finish (SPF). Offer unique vacuum and gas flow technology, optimized RF energy delivery methods and temperature management. Said to help protection printed circuit boards against creep corrosion and environmental pollutants, extend PCB shelf life, and improve RF performance. SPF 1500 is for medium-to-high volume production, and SPF 1000 for lower throughput or high-mix production.
CITS880 Controlled Impedance Test System Enables automatic verification of PCB characteristics impedance. Is based on TDR architecture of CITS800, and adds latest generation of control architecture for faster throughput. Combines differential and single-ended measurement of impedance with four channels to provide fast and flexible probe connections. Windows-based software. Automatically logs data and outputs results as customer conformance reports with optional Datalog Report Generator; or exports for real-time SPC. Features multi-point traceable calibration and optional crosstalk testing. Allows users to demonstrate quality conformance to NIST and NPL traceable air-line reference national standards.
Ecoganth MV electroless copper process is free of formaldehyde, Ni, P, and CN-. Is combined with a biodegradable complexing agent. Is capable for mixed production (ABF resins and cores). Benefits include a high throwing power and a deposition rate that is adjustable by temperature and stabilizer dosing.
