XJTAG v. 3.0 boundary scan development software is faster and more intuitive. Features run-time enhancements which boost the speed of XJEase testing and device programming in XJDeveloper and XJRunner. XJAnalyser can now be used as an integrated function in XJDeveloper as well as in its standalone form. Now uses knowledge contained in an XJDeveloper project (netlist information, constant pin settings, etc.), and XJAnalyser can open XJDeveloper and XJRunner projects, while XJDeveloper can access the full functionality of XJAnalyser. JTAG Chain Debugger now integrated into XJDeveloper.

XJTAG, www.xjtag.com

OE-6662 and OE-6652 phenyl silicone optical encapsulants are two-part, heat-curable products for improved reliability, anti-silver corrosion and durability for light-emitting diode (LED) designs. Offer Shore D 64 and Shore D 59 levels of hardness, respectively. Improved gas barrier performance protects delicate Ag-plated LED electrodes from sulfur attacks. In addition to inhibiting degradation of light output efficiency, this can extend the overall quality and lifetime of advanced LED designs.

Dow Corning, dowcorning.com/lighting

Passive air-cooled heat sinks feature improved airside heat transfer performance. Integrate novel vapor chamber technology within a 3D thermal solution, with vapor flow spreading heat both laterally in the base and into planar appendage heat pipe blades. High-density fins are attached to the planar blades to enhance thermal performance. Reportedly feature thermal uniformity and low thermal resistance. Handle heat loads from 250W to 2,000W, depending on model. Built with copper (wall and wick) and aluminum (fins); the working fluid can be water or methanol. Customizable mounting features .

Thermacore, www.thermacore.com

Microfill LVF Via Fill electrolytic copper for enhanced microvia filling is for electrolytic copper plating of high density interconnect (HDI) printed circuit boards (PCB). Reportedly is capable of 10–15μm plating thicknesses, microvia filling, high filling efficiency and reduced copper usage. Improves panel and pattern plating distribution and features thermal reliability.

Dow Chemical Co. www.dow.com