New Products

MR2 router is capable of 0.0005” accuracy at 39" per sec. or milling through a trace at 0.5 mil tolerances. Features include heavy-duty construction, with stable mounting base constructed of solid, precision-ground, two-in-thick steel. Overhead gantry uses THK bal screws and closed-loop servo drives. Touch-screen interface.

CTI Systems, www.cti-depaneling.com

FPP25 ASIC/SOC prototyping platform is for emulating designs of up to 25 million ASIC gates. Is based on Xilinx Virtex-7 2000T FPGAs. Integrates Flexras Wasga automatic partitioning design suite, offering partitioning, timing analysis and pin-multiplexing solutions. Can optionally add Adacsys AVA (advanced verification acceleration) software, as well as Xilinx Vivado Design Suite and Xilinx ChipScope debugging tools. Operates with a GbE interface, a USB interface, or a 4-lane PCIe cable. Each FPGA intercommunicates by nearly 400 LVDS signals at 1.25Gbps. An onboard CPU with an embedded Linux operating system is implemented to handle the configuration and monitoring functions. Up to 5 platforms can be changed together to address high-density designs of more than 125 million ASIC gates.

Reflex CES, http://www.reflexces.com/en/

CN-1751-4 underfill encapsulant is reportedly crack resistant; withstands flexing experienced by flexible printed circuitry or drops and shocks of thin printed circuit assemblies. Reportedly can withstand deformation without cracking; has a modulus higher than traditional reworkable underfills. Has a CTE of 48 ppm/°C. Viscosity is 900 cps. Can be reworked at 170° to 180°C to remove underfill fillet. Underfill residue is scraped off at 170° to 180°C.

Zymet, www.zymet.com

Vision series hydraulic presses with optional lamination package are used to manufacture components for US submarines. These up-acting column presses feature hydraulic power unit, electronic control package and point-of-operation guarding. Electrically heated platens yield temperature uniformity to 480º F. Platens are designed for cooling via multiple passages for water circulation and deliver temperature uniformity of +/- 5º F over 95% of the surface area. ASTM package provides heating uniformity and cooling rates of 15º C per min. Presses feature adjustable pressing speed and tonnage controls with a dual-label pressure and tonnage gauge to display press settings. Process control package is optional. Include TEFC electric motor, a variable displacement pump, and a controlled cooling loop. Automatic valve on cooling circuit regulates and maintains oil temperature. Have powered front gates with interlock switch. Available in 10- to 150-ton models for lamination, compression, transfer or vacuum molding.

French Oil Mill Machinery, www.frenchoil.com, www.techmach.com

FloEFD concurrent computational fluid dynamics simulation helps provide "what-if" analysis. Includes automated geometry clean-up. Has the ability to mesh complex models. Includes a Parametric Study Tool and NASTRAN Bridge. A compare tool provides results from projects from different configurations in one window. Provides improved geometry handling. Can copy conditions to other component instances without having to repeat the same operation. Has redesigned interface. Can export pressure and temperature data. Includes leaks tracking tool. Local erosion/accretion rates can be visualized at surfaces.

Mentor Graphics, www.mentor.com

Embedded Capacitance Material (ECM) C2006 thin laminate material has a capacitance density of approximately 20 nF per sq. in. Reportedly can improve power integrity and reduce electromagnetic interference in small devices such as microphones, sensors, IC packaging and interposers. Helps achieve high-fidelity signals, high signal-to-noise ratio in radio frequencies, and higher speed digital signals in high-performance applications.

3M Electronic Solution Division – Interconnect, www.3Mconnectors.com

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