PolyFLEX XF-100 series polyimide flexible substrates can be printed with resistive, conductive and semi-conductive inks. Are reportedly suitable for applications that demand dimensional stability after repetitive exposure to high temperatures. Resistant to chemicals normally used in printed circuit boards and electronic devices. Durable top coats enable high resolution printing. Offer dimensional and electrical stability  up to 300°C. Applications include printed electronics, flexible heaters, flexible OLEDs, temperature sensors, flex circuits, smart bandages, RFID antennas, portable devices and electrical circuits. Line includes 1 mil (25µm) to 5 mil (127µm) versions with white or clear print surfaces.

Polyonics, http://www.polyonics.com

Model 5950 microfabrication system has beam steering technology for printed circuit board singulation. Designed to handle standard, fully occupied printed circuit boards. Features control cutting shape, throughput, and laser-material interaction. Can minimize spacing between adjacent devices. Reportedly eliminates carbonization. Is targeted for consumer electronics, specifically circuit boards for the mobile segment.

ESI, www.esi.com 

FasTRAK plasma system is an automated vacuum plasma treatment system for lead-frame strips, laminate substrates, and other strip-type microelectronic components. Uses robotic movement; reportedly accommodates full known range of magazines and strip width, length, and thickness dimensions. Designed to lower handling risk to sensitive substrate materials. Material tracking software and internal camera count the number of strips and track their progress throughout treatment process. Up to 10 strips can be accommodated per batch. Measures 1.65m x 1.5m. Includes a plasma chamber that can be configured for direct or ion-free plasma modes. Typical plasma applications include pre-die attach; pre-wire bond; pre-mold; post-mold, and pre-underfill. 

Nordson March, http://www.nordson.com/en-us/divisions/march/pages/default.aspx

K7000 singulates thin pre-scored panels with close component spacing. Is said to safely depanelize boards as thin as 0.020”.

Read more: FKN Systek Releases K7000 PCB Depaneler