MCL-E-800G/MCL-E-705G series semiconductor package substrate materials are halogen-free, high Tg, low thermal expansion. 800G series has a CTE of 2.8ppm/℃, and is for use in package-o-package (PoP) and FC-BGA interposer substrates. MCL-E-705G series is suitable for multi-tiered structures such as stacked semiconductor packages.

Hitachi Chemical, www.hitachi-chem.co.jp/english/index.html

PPC-007 liquid coating protection for phototools is suitable for application by the RTS Panda coater. The coater applies four microns of a liquid coating, which cures under ultraviolet (UV) light. Is optically clear, and provides a non-stick and abrasion resistant surface that protects the phototool surface.

Rainbow Technology Systems, www.rainbow-technology.com

Integrated filter design flow enables users of FilterSolutions software to export results directly into CST Studio Suite. User is able to manipulate the pole and zero crossings of the filter prior to exporting the filter design. Once exported, a block schematic representation is automatically produced as a basis of an automatically created 3D model. Using CST Microwave Studio Method of Moments-based multilayer solver, a 3D analysis of the filter can be performed.

Computer Simulation Technology, www.cst.com
Nuhertz Technologies, www.nuhertz.com

Paragon-Xpress 12 laser direct imaging system supports features sizes down to 20μm. Throughput reportedly up to 5,000 panels per day. Handles HDI, flex and rigid-flex printed circuit boards. Said to have high registration accuracy.

Orbotech, www.orbotech.com