SMT Card-Edge Connector System is based on 0.64mm press-fit technology. Is a discrete pick-and-place SMT component that creates a solderless edge card interconnection for daughter board applications. Contacts can be placed on a daughter card using standard high-speed pick-and-place surface mount equipment. SMD solder interface uses pin-in-paste through-hole technology and recessed channels for solder distribution. Is designed for standard 1.6mm thick printed circuit boards, but is compatible with additional PCB thicknesses. Center min. PCB spacing is 3.2mm. Is packaged in a 16 x 4mm pitch EIA tape on a 13" diameter plastic reel for compatibility to standard high-speed surface mount pick-and-place equipment. Is suitable for high-conductivity material, able to carry up to 15A per contact.

Interplex Industries, www.interplex.com/card-edge

Multisim 12.0 Professional Edition has specialized editions for circuit design and electronics education.

Read more: National Instruments Debuts Multisim 12.0

High-capacitance embedded capacitance material reportedly improves power integrity and reduces electromagnetic interference in miniaturized devices. Is halogen-free. Helps provide hi-fidelity signals, high-signal-to-noise ratio in radio frequencies, and higher speed digital signals in high-performance applications such as small form factor printed circuit board hardware, high-performance RF boards, microphones, integrated circuit packaging, and consumer electronics. Offers a capacitance density range from 20 up to 40nF per sq. in.

3M, www.3M.com/ecm

Rainbow Process incorporates printed circuit board coating, imaging and developing in a single compact, automated unit.

Read more: Rainbow Technology Debuts Rainbow Process Imaging Systems