HyperLynx 8.2 suite of analysis tools offers new functionality for printed circuit board designs, including 3D full-wave field solving and integrated thermal/power co-simulation analysis capabilities.

InSolver PCB impedance field solver reportedly enables fast and accurate stackup and impedance modeling for a range of PCB structures. Solves standard single-ended and differential impedance constraints, as well as a wide range of broadside coupled, coplanar and embedded models to accurately simulate impedance for the most complex structures. Powered by Mentor Graphics' HyperLynx technology. Comes embedded in InPlan or InStack, or as a standalone application.

Frontline PCB Solutions, www.frontline-pcb.com

IntelliTool electroplating tooling concept is said to improve uniformity and deposition speed of copper electrodeposition on printed circuit boards.

Silver Ink is capable of forming electronic circuits. Requires no heating. Hardens under ultraviolet (UV) light for approximately 0.3 sec. Film thickness of five micrometers produces wiring with electrical resistivity of 10-3cm. Permits wiring on glass base material and substrates, flexible base material and polyester film (PET film).

Tanaka Kikinzoku Kogyo, www.tanaka.co.jp