New Products

Single-piece CBS shield has a height of 0.039". Is a low-profile board-level shield ideal for smaller handheld and portable electronic devices. Manufactured from RoHS-compliant materials; reportedly exhibits exceptional solder characteristics and corrosion resistance.

Leader Tech, www.leadertechinc.com

Pantheon 7 PCB/hybrid/RF layout software now includes a redesigned user interface and similar user interface features previously available in schematic design and library management tools Mozaix and Indx. Standard user interface features include multi-window support for real-time edit and update of geometries on the board; project explorer with quick access to board, block, component, net, and part references; quick search toolbar; undocked toolbars; window control toolbar, and a redesigned menu structure.

Intercept Technology, www.intercept.com

CST PCB Studio 2012 includes CST PCB Studio IR-drop solver, permitting quick calculation of current distribution and voltage drop on multilayered printed circuit boards and packages.

Read more: CST Delivers CST PCB Studio 2012

SPH1 family of compression connector products for flex-to-board and board-to-board applications combine high density and reliability with electrical performance. Come in area-array styles at 0.8mm, 1.0mm and 1.27mm pitch, with pin counts ranging from 80 to 120 positions. Interposer thicknesses range from 0.5mm to 3.0mm fully mated. RoHS 2002/95/EC compliant.

Neoconix, www.neoconix.com

RO-Linx PowerCircuit Busbars provide multifunction capability in a single, compact form factor. Distribute power and signal lines or can have components mounted on the busbar structures to save space and weight. Are 3D, for a range of power distribution applications in EV/HEVs, wind/solar power, and variable-frequency-drive (VFD) markets. Solder-process compatible.

Rogers Corp., rogerscorp.com

Simbeor signal integrity software, for physical design of PCB and packaging interconnects operating at 6-100 Gb/s and above, now features geometry import from ODB++ files to fit Simbeor into any design flow; Via Analyzer tool to synthesize geometry for transparent via-holes and connector launches; multi-variable optimization capability for geometry optimization and identification of dielectric and conductor roughness models; anisotropic dielectric model for accurate analysis of via-holes; Huray snowball and modified Hammerstad conductor roughness models for accurate analysis of PCB and packaging traces; and automatic computation, plotting and output of nine common serial interconnects compliance metrics.

Simberian, www.simberian.com



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