CST Studio Suite now comes with Filter Designer 2D, permitting synthesis, electromagnetic simulation, optimization and multiphysics analysis of filters in one single environment. Includes a database with a wide variety of filter types, including both lumped element and distributed element implementations. Users input the specifications of the filter – including both the frequency response and any physical limitations, such as the maximum size of the filter and the properties of the substrate – and a design is automatically suggested. Creates fully parametric models for either circuit simulation or full-wave 3D simulation. Built on Nuhertz Technologies’ technology, the integration means the full workflow can now be carried out with a single tool.

Computer Simulation Technology (CST), www.cst.com

RO3003, RO3035 and RO3203 low dielectric constant laminate materials now have rolled copper cladding options. Smooth rolled copper, paired with the low dielectric loss of RO3000 PTFE-ceramic resin system, reportedly results in high-frequency circuit materials with excellent insertion loss. Materials are ideal for loss-critical mm-wave frequency designs. RO3003 3.0 dielectric constant laminates are now available with rolled copper foils from 0.5oz up to 0.040” thick rolled copper plate.

Rogers Corp., www.rogerscorp.com

Sarcon SPG-20B thermal interface compound is a low-viscosity thermally conductive silicone. Delivers thermal conductivity of 2.1 W/m°K and a thermal resistance of 1.8°C cm²/W. When applied between a heat-generating component and a nearby heat sink or spreader, the material reportedly fills all gaps to improve cooling performance. Requires no heat curing; does not cause corrosion on metal surfaces, and maintains initial properties across a temperature range of -40° to + 150°C. Has vibration absorption.

Fujipoly America, www.fujipoly.com

EPD v8.2 includes netlist capture upgrades such as accurately capturing irregular shape component bondpads, captures clips and heatslugs in leadframes. Supports AutoCAD version 2015 and BricsCAD v. 14.2. Improved 3D Bondwire clearance checking technology works on 3D EPD-created JEDEC wires.

CAD Design Software, a Division of CAD Design Services, cad-design.com/support/epd82releasenotes.html