Enhancements to existing Allegro commands include Enhanced Back Drill for back-drilling high-speed boards. Automatically creates route keep-outs for area contained in back-drill path. Dxf2mcm, for Cadence ADI/SiP tools for IC package design, imports any DXF drawings or files and creates intelligence.

dalTools, www.daltools.com

CITS880s controlled impedance tester now features Launch Point Extrapolation (LPE) for fabricator-level instantaneous measurement and control on high-speed PCBs. LPE is a line-fit technique deployed on thinner traces which exhibit significant slope arising from DC and AC resistance along the trace. LPE “projects the impedance back” to a point close to the start of the trace where the influence of the DC and AC resistance on the measurement is minimal. In conjunction with 2D field solvers, is said to yield significant improvement in correlation between measured and modelled impedance. With high-speed IPS probes, tests trace lengths 2 to 3" shorter than previous versions. Outputs reports using novel software or in Excel-compatible format. 

Polar Instruments,  http://www.polarinstruments.com/

Publish 3D for Quality Control software application contain clear illustrations of products, components and subassemblies combined with technical specifications, notes and care points that can be configured to auto-populate from databases and PLM systems.  Allows publishing of media rich documents with embedded 3D CAD models that. Tablet or PC friendly. Aids QC initiative development and communication. Can be tailored to suit specific requirements. Can hold QC instructions, engineering data, 3D CAD models, cost of quality information, SPC data, technical specifications, briefing notes and any information held in a folder or in a database. Interactive 3D data can be published directly from native CAD data held on PLM systems without CAD operator assistance. 

Theorem Solutions, www.theorem.com/dm/3dpdf-quality-stq.htm

W-Series Matrix connector reportedly eliminates the need to solder the LGA to the printed circuit board. Is silicone-based and embedded with 300 to 2,000 gold-plated wires per cm2. Provides current carrying capacity of 500 mA/mm2. Is available in sizes up to 50mm x 50mm and thicknesses of 0.50mm or 1.0mm.

Fujipoly America, http://www.fujipoly.com