Xpedition Systems Designer software for multi-board systems connectivity captures the hardware description of multi-board systems, from logical system definition down to individual PCBs, automating multi-level system design synchronization processes for team collaboration with accuracy and faster design productivity. Captures complete logic system definitions in systems of up to multiple boards, cables and other elements (backplane, cable assemblies, sensors and actuators). Unique design "cockpit" enables system-wide partitioning of logical system blocks into individual PCBs. Fully supports concurrent design, enabling team members to simultaneously engineer and collaborate on different components of the system. System architectures created in Visio can by imported to accelerate system capture. Advanced synchronization work-in-progress design data enables multiple engineers to concurrently collaborate on the logical system level, as well as within the lower-level PCB projects. Systems can be partitioned into multiple board projects and associated connectivity. Automated connectivity synchronizes changes across the system, enabling "what-if" re-partitioning exercises to optimize the system for performance, size and cost. Features on-the-fly creation of parameterized connectors. Automated connector mating and pin pairing, as well as synchronization between PCB projects and system design data, eliminates connector errors throughout the design cycle. Automates connectivity definition and verification, and traces signals across the entire system to ensure that connectivity is as specified.
AVIA NX series of q-switched, diode-pumped, solid-state lasers offer output powers up to 40W at 355nm. Are said to be smaller, lighter, and more robust than other UV lasers of the same power level. Feature patented pumping technology of the Nd:YVO4 gain medium, for increased overall system efficiency (conversion of input electrical energy into usable light). Also incorporates novel optical mounting technology, for enhanced stability and long-term reliability. For PCB via hole drilling, drilling and cutting of flex materials, 3D IC chip fabrication, IC chip package trimming, as well as other processes in support of system-in-package (SiP) manufacture.
White Teijin Tetoron UF Polyethylene Terephthalate films (PET) and Teonex QF Polyethylene Naphthalate (PEN) films are halogen-free and flame-retardant. Combine chemical resistance, strength and insulation properties with the VTM-0 flame rating available from UL’s UL 94 flame classification testing. Are available in thicknesses ranging from 25 to 250µm. Typical applications include insulating materials and labels for electronic products. At thicknesses of 125 µm or more, the films provide more than 90% diffuse reflectance across the visible wavelength spectrum. Teonex QF PEN films are capable of withstanding processing at temperatures over 180°C.
M-Speed is a chemical process supporting fabrication of high-frequency printed circuit boards. Provides low-profile innerlayer copper; delivers strong adhesion to all high-speed dielectrics. Chemicals offer cleaning, etching, and copper surface modification for optimal innerlayer bonding. Provide low-profile surface topography. Copper-to-resin adhesion and thermal resistance reportedly exceeds alternative chemical processes.
ESD tape provides safety from ESD damage. Is made of three layers: two dissipating copolymer substrates on the outside and a conductive layer between them. Reportedly provides strong adhesion and meets or exceeds requirements of ANSI ESD-S20.20. Is non-charge generating; safe for all ESD applications. Is good for multiple uses and is available in sleeves of six.
