New Products

DF65 Series connector is a vertical-mating wire-to-board connector that provides high-current capacity and high reliability for power supplies, up to 4A (with 24 AWG wire) and 50V AC/DC. Features a 1.7mm pitch and 1.8mm mated height. Vertical mating maximizes board space and reportedly reduces assembly time. Has locking system for high-vibration; is suited for use with a DC jack or battery pack. Double-locking structure reinforces engagement between socket and header. Positive lock secures socket into header; produces over 5N cable pull strength in the upper direction. Friction lock system produces final click; prevents socket from floating after mating. Has operating temp. range of -35° to +105°C; limits contact resistance to 10M ohms max. with an insulation resistance of at least 100M ohms min. at 100V DC. RoHS compliant.

Hirose, www.hirose.com/us

 

PE510 copper conductive ink is for antenna, membrane touch switch (MTS), radio-frequency identification (RFID), and consumer electronic applications. For processing low-lamp-voltage copper metallization circuit designs on a range of substrates including FR-4, PVC, polyimide film and PET.  Can be processed using high-speed photonic curing equipment and provides a long lamp life as well as superior adhesion and processing. Achieves high printed line and space resolution. 

DuPont Microcircuit Materials, mcm.dupont.com

Circuposit 6000 electroless copper process is for high-reliability HDI circuit boards. Offers enhanced microvia reliability and improved performance.

Dow Electronic Materials, www.dowelectronicmaterials.com

 

CircuitStudio is a printed circuit board design tool based on straightforward schematic capture and project management tools. Is reportedly easy to use, but powerful enough for professionals. Has a PCB design engine that supports 3D PCB editing.

Altium
element14
www.circuitstudio.com
www.element14.com/altiumcs

 

DFMplus design for manufacture software addresses potential issues in the PCB design phase to ensure manufacturability. Verifies PCB designs before placing ordering, resulting in a smoother ordering process. Aids in project schematics simulation prior to physical layout. Previews possible failure points, for debugging and testing. Enables easier, more efficient design file data transfer to manufacturing. Assists customers in finding the right Sunstone service for a board project. Accepts partial designs, or regions of the design, as a section-by-section check. Supplies comprehensive DRC results, shows all errors in one pass. Reports results within hours. PCBpro Full Feature eliminates layer mapping requirements from ordering process, saving time. 

Sunstone Circuits, www.sunstone.com

Techni IM Gold AT8000 non-cyanide immersion gold is said to improve solderability while reducing gold usage when compared to typical cyanide based ENIG chemistry. Slows and controls deposition of gold on electroless nickel, reportedly eliminating corrosion products and creating a pore-free ENIG deposit with better solder spread. Controlled deposition provides more uniform plating thickness across different pad sizes. Substantial gold savings possible due to combination of tighter thickness distribution and thinner gold deposits. Technic TechniIMGold

Technic, www.technic.com

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