VIENNA, AUSTRIA – Werner Engelmaier received the TGM-Exner-Medal from the Technologisches Gewerbe Museum and the Austrian government.
 
Engelmaier received the medal in recognition of his accomplishments in electronic packaging and interconnection technology during his nearly 25 years at Bell Telephone Laboratories and 20 years as an industry consultant.
 
He is the president of Engelmaier Associates L.C. in Ormond Beach, Florida.

BANNOCKBURN, IL – A new white paper attempts to clarify facts and misconceptions surrounding high-density interconnect and dispute the sentiment that the North American PCB industry cannot produce HDI boards.

An Executive Overview of HDI The Reality of HDI: Fact vs. Myth was written by a group of IPC PCB fabricators to support the manufacture of HDI PCBs and facts regarding its expense.      

The need for HDI is being driven by miniaturization, lower costs, and improved reliability, says the association. The paper addresses the ways HDI technology adds efficiency and quality in meeting those demands, and presents survey results and analysis of market opportunities, as well as information on cost implementation and advantages.

Contributors to the white paper include Jay Desai, director of marketing for Multi-Fineline Electronix; Terry Heilman, president and CEO of Sunstone Circuits; Nilesh Naik, CEO of Onesource Group; Joseph O’Neil, president of Hunter Technology; Greg Papandrew, president of Bare Board Group; Ren Sanscrainte, global account manager of Viasystems, and Al Wasserzug, director of business development for Vulcan Flex Circuit.
A free download is available to IPC members at www.ipc.org/HDI-Executive-Overview