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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

  • Flex Shock and Vibration

    Flex Shock and Vibration

    PSAs and carefully chosen connectors can reduce the shock of intense conditions.  READ MORE...

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Fab News

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Category: Fab News
TAIPEI, TAIWAN – Nanya Printed Circuit Board, Tripod Technology and Unimicron Technology will supply HDI boards for the latest iPhone, due out in June, says DigiTimes.
 
During the second quarter, Flexium Interconnect and Career Technology began shipping flexible PCBs for the iPhone to Apple, reports DigiTimes.  

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Category: Fab News
HUNT VALLEY, MD and OTTENDORF-OKRILLA, GERMANY – Reactive NanoTechnologies Inc. (RNT) and FHR Anlagenbau GmbH (FHR) have signed a license agreement for RNT’s NanoFoil and NanoBond technologies.
 
At its facilities near Dresden, FHR employs NanoBond to bond sputter targets, supplying optimal target assemblies for specific applications. The company is also developing specific target designs for high rate sputtering, photovoltaic and optoelectronic solutions, according to Christian Raensch, COO.

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Category: Fab News
MINNEAPOLIS -- HEI Inc. today announced first-quarter sales fell 3% to $8.9 million, but the company reversed last year's net loss.

For the period ended April 4, the net income was $268,000, up from a net loss of $440,000 for the same period last year.

The company credited improvements over the past two years at its plants. HEI manufactures flex and rigid-flex PCBs in its Tempe, AZ facility.

HEI CEO Mark B. Thomas said, "The current economic conditions are having an impact on the demand for our customer's products along with substantial pricing pressures for the products that we build."

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Category: Fab News
CHANDLER, AZ -- ISOLA GROUP has entered into a non-exclusive license agreement with Sanmina – SCI allowing practice under US Patent Nos. 5,350,621 and 5,464,658, covering the use of square weave fabric materials.

“We believe that the adoption of Isola square weave technology provides a competitive advantage to Sanmina-SCI PCB Division because it allows increased design flexibility by providing improved registration and reliability to high performance applications,” stated George Dudnikov, CTO of Sanmina-SCI’s PCB Division.

Sanmina is the first PCB fabricator to license this technology.

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Category: Fab News
TAIPEI, TAIWAN – Unitech, no. 32 in the NTI top 100, expects a 20% sequential revenue increase in Q2 according to Cheng-Hung Hsu, general manager, as reported by Digitimes. Hsu forecasted overall global PCB production value would drop 20% for the year.

Company chairman Pen-Tsao Chang commented on Unitech’s HDI board production, indicating production of 4+n+4 products has begun in the Taiwan plant and pre-production of 3+n+3 products has started in the China, according to Digitimes.

In May Unitech began manufacturing 1+n+1 HDI boards for CULV notebooks and is supplying products combining HDI and rigid-flex PCBs for smartphone applications.

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Category: Fab News
TAIPEI, TAIWAN – HannStar Board Corp. plans to expand production capacity for HDI boards. The company will invest NT$1 billion (US$29.4 million) to increase monthly output from 100,000 square meters to 250,000 square meters.

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