Printed Circuit Design & Fab Online Magazine - Fab News

Fab News

Details: Written by Staff; Category: Fab News; Published: 23 June 2009

SAN DIEGO and MCLEAN, VA – The board of directors for SAIC Inc. named Walter Havenstein CEO, effective September 21, 2009. He will also become a member of the board of directors.

He will replace Ken Dahlberg who is stepping down from the position but will remain as chairman of the board through June 2010.

Havenstein brings more than 25 years of industry experience, having recently served as COO and board member of BAE Systems plc, as well as president and CEO of BAE Systems Inc.

He was held executive management and business development positions with Raytheon and Sanders.

SAIC is a scientific, engineering and technology applications company that serves the US Department of Defense, the US Department of Homeland Security, civil agencies and commercial markets.

Details: Written by Staff; Category: Fab News; Published: 19 June 2009

WEST SUSSEX, UK --Teknoflex Ltd. has appointed Hiconnex as its agent in South Africa.

Andrea Shorrock, export sales and marketing manager said, "We are confident that the strength and expertise of Hiconnex will be a tremendous asset in providing a first class service in support of our ever increasing customer base in the South African market."

Teknoflex design, fabricate and assemble flex and rigid-flex PCBs. Hiconnex supply cables and interconnect solutions for the telecom, broadcast and military/aerospace markets.

Details: Written by Staff; Category: Fab News; Published: 17 June 2009

BEAVERTON, OR – Merix Corp. has received a multi-million dollar order from Rockwell Collins.

The company’s PCBs will be used in military and defense design and development, including cabin electronics, military communications and flight deck avionics.

Rockwell Collins provides communication and aviation electronic solutions for both commercial and government segments worldwide.

Details: Written by Staff; Category: Fab News; Published: 16 June 2009

MUNICH, GERMANY and WESTFORD, MA – Zuken has named Novatrace as its CADSTAR distributor in the Netherlands, Belgium and Luxembourg.

Novatrace will handle all CADSTAR sales and first-line support, with existing customers being automatically transferred. CADSTAR is a complete PCB design solution, incorporating technologies needed for a total electronic development process into one environment.

Zuken optimizes electrical and electronic engineering designs and related manufacturing processes for companies worldwide. Novatrace works with its high-tech partners to provide a complete PCB design and EDA solution product-services package, as well as training and prototype assembly.

OULU, FINLAND – Sami Holopainen has been appointed CEO of Aspocomp Group Oyj, effective June 22.

Holopainen has been with the company since 2000, serving as vice president of corporate development, CFO and general manager of Aspocomp (Thailand) Co. He has been CFO of Aspocomp Group since May.

Aspocomp manufactures medium to high volume HDI/Microvia PCBs, thick film hybrid circuits and mechanical assemblies.

BANNOCKBURN, IL – the IPC has released IPC-4553A, Specification for Immersion Silver Plating for Printed Boards that includes revised specifications for the immersion silver (IAg) coating used as a surface finish for printed boards.

Revision A provides a single thickness range that should reduce any confusion associated with the original 2005 IPC-4553 document that included two thickness ranges, one for “thin” deposits and one for “thick” deposits.

According to the subcommittee co-chairs, George Milad, national accounts manager for technology, Uyemura International Corp. and Gerard O'Brien, president ST and S Group, a single thickness range is now possible because the thickness termed “thin” is now such a minor portion of the total [IAg] market, it does not need to be included in the specification.