Printed Circuit Design & Fab Online Magazine - Fab News

Fab News

Details: Written by Staff; Category: Fab News; Published: 07 June 2012

INDIANAPOLIS – A quartet of researchers has published a new book describing the lifecycles of electronics parts and software, and explaining processes of obsolescence forecasting, and reactive, proactive, and strategic management of obsolescence. Read more ...

Details: Written by Staff; Category: Fab News; Published: 06 June 2012

FREDERICKSBURG, VA -- A local printed circuit board fabricator has launched a initiative to buy American-made products whenever possible.

Details: Written by Staff; Category: Fab News; Published: 04 June 2012

BANNOCKBURN, IL – The final draft for industry review of IPC-4903, A Guideline for Defining "Low-Halogen" Electronic Products, is available for comment.

The comment period for this circulation is 60 days. All comments should be returned to This email address is being protected from spambots. You need JavaScript enabled to view it. by Aug. 4.

The developing committee will discuss and resolve comments received on this circulation at a venue to be announced.

While any interested party may join the ballot group, active participation would be required from this point forward. Participation in any of the following events
would be considered active participation: contribution to standard content, attendance at face-to-face meetings, participation in teleconference and/or web meetings, and comments to drafts of standards.

ST. LOUIS – Viasystems Group says it has completed its $283 million acquisition of DDi Corp.

Viasystems originally announced the acquisition April 4.

The combined company provides a North American manufacturing presence serving high-mix, low-to-medium-volume manufacturing.

The company now has more than 15,600 employees and manufacturing floor space exceeding 4.3 million sq. ft. in China and 1 million sq. ft. in North America.

BANNOCKBURN, IL – IPC released the A revision of IPC-4204, Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry.

The updated standard details materials that let designers and manufacturers move to higher frequencies. Along with enabling the reach of higher frequencies, the revised standard focuses on improved dimensional stability, particularly for adhesiveless assemblies.

IPC-4204A addresses the basic aspects of flexible circuit board design and includes more focused information. Specification sheets at the end of the document provide information for classes of materials, including polyimides, liquid crystal polymers and polyesters.

For more information, visit www.ipc.org/4204.

Committee members are now planning to revise IPC-4203, Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films. IPC-4203A is expected to be released this fall.