TAIPEI -- Registration is open for the International Microsystems, Packaging, Assembly and Circuits Technology Conference, one of the largest commercial and academic conferences on electronics in the world.

The event will feature some 190 papers from industry, academic and R&D institutes from 14 countries.

Five plenary speakers will be featured, including Dan Kinzer, CTO and senior VP of Fairchild Semiconductor, who will speak on advances in power semiconductor technology and packaging; Enboa Wu, vice president of ASTRI (HK), on product oriented packaging; Dr. Tsuyoshi Abe, director and Vice President of Intel, on the semiconductor industry; Michael Roesch, manager of HP, on material management; and Mark Brillhart, vice president of Cisco.

IMPACT is jointly organized by IEEE CPMT-Taipei, iMAPS-Taiwan, ITRI and TPCA, and will be held in conjunction with the TPCA Show Oct. 24-26, at the Taipei Nangang Exhibition Hall.

For information: www.impact.org.tw.

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