Umicore MDS, the exclusive European distributor for the Japanese plating specialist Uyemura, has successfully installed the advanced Thru-Cup® EVF-YF9 copper process for plating blind vias (blind holes) at the high-tech PCB manufacturer Hi-Tech Corporation in North Macedonia. The project underscores Umicore MDS’s long-standing expertise in implementing and supporting sophisticated Uyemura processes at leading European PCB manufacturers.
Thru-Cup® EVF-YF9 is an electrolytic copper process specifically developed for the reliable plating of blind vias. It offers exceptional process stability, particularly due to the (CVS) analyzability of all additives used, a long service life and enables the simultaneous plating of through-holes (PTH) and blind vias in panel and pattern technology – a decisive advantage for the production of complex HDI printed circuit boards. The process is also REACH-compliant and meets the highest environmental sustainability standards.
“The installation at Hi-Tech, carried out in close collaboration with the process supplier Uyemura and the European equipment manufacturer involved, is an excellent example of successful international cooperation,” explains Andreas Groß, Head of PCB Processes at Umicore MDS. “Especially in times when Europe is losing ground in the field of printed circuit board manufacturing and dependence on Asian markets is growing, such projects are particularly important. They demonstrate how European industry can regain its competitive edge – through the careful selection of reliable project partners and trusting collaboration at all levels.”
Based in Skopje, Hi-Tech Corporation has been a leading manufacturer of complex printed circuit boards for demanding applications in the automotive, telecommunications, medical technology and industrial sectors for over 40 years. Umicore MDS supports its long-standing customer Hi-Tech by providing innovative coating solutions to help ensure its technological leadership in a global competitive environment.
Milan Stankovic, Director of Manufacturing at Hi-Tech, is extremely pleased with how the project has progressed: “The new process delivers consistent, high-quality results with short cycle times. Without the support of Umicore and Uyemura, we would not have achieved these results in such a short time. Their technical expertise was crucial – both in configuring the equipment and in ramping up the process.”
For decades, Umicore MDS has been successfully implementing Uyemura processes at European printed circuit board manufacturers. Technical expertise, a deep understanding of the process and high service standards make the company a reliable partner for sophisticated plating solutions.
Umicore MDS, the exclusive European distributor for the Japanese plating specialist Uyemura, has successfully installed the advanced Thru-Cup® EVF-YF9 copper process for plating blind vias (blind holes) at the high-tech PCB manufacturer Hi-Tech Corporation in North Macedonia. The project underscores Umicore MDS’s long-standing expertise in implementing and supporting sophisticated Uyemura processes at leading European PCB manufacturers.
Thru-Cup® EVF-YF9 is an electrolytic copper process specifically developed for the reliable plating of blind vias. It offers exceptional process stability, particularly due to the (CVS) analyzability of all additives used, a long service life and enables the simultaneous plating of through-holes (PTH) and blind vias in panel and pattern technology – a decisive advantage for the production of complex HDI printed circuit boards. The process is also REACH-compliant and meets the highest environmental sustainability standards.
