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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

Details

X-Press is a multilayer press that maintains +/-1° control over temp. for every multilayer.

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HM66M surface mount device power inductors are for use in high-frequency power conversion systems and EMI filter applications.

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TechniMask ISR1000F/900G liquid photo-definable, flexible white gloss solder mask is designed for LED applications.

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FW8S and FW8D DC/DC converters have 8W low-noise 2:1 input range that accepts 4.5 to 9VDC, 9 to 18VDC, or 18 to 36VDC and 36 to 72VDC input with on/off control.

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SVPT long-life surface mount-type OS-CON conductive polymer-aluminum-solid capacitors are available with a rated voltage of 2.5VDC, 6.3VDC and 16VDC.

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Details

Quad Small Form Factor Pluggable Double Density (QSFP-DD) connectors, cages and cable assemblies address next-generation data center needs by increasing density through existing QSFP form factor to reach speeds up to 400Gbps.

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