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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

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Multi-Beam Plus power connectors provide a high current per power contact at a maximum of 140A/contact or 100 A/contact per four adjacent contacts. Scalable and modular design supports greater flexibility in configuration and printed circuit board (PCB) design.

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PathWave Test 2020 software streamlines test data processing and analysis.

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Imagecure solder mask is for high-temperature automotive applications.

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Micro Prober MP series measurement systems (MP502 and MP502-A) continuously inspect high-frequency characteristics of PCBs.

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Ledia 6H direct imaging system offers flexible control enabled by three wavelength light sources for broader coverage of the wavelength regions for exposure, significantly expanding the number of supported resist types.

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ZE05 series low-profile wire-to-board connector is for high heat and high vibration applications, including automotive, off-highway and transportation.

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