Systek UVF 100 is a 2-in-1 plating system for buildup of redistribution layers.

Is pattern plating process capable of filling blind micro vias and laser-drilled x-vias, as well as plating fine lines, pads, and other surface features with coplanarity and controlled profile. RDL blind micro vias and x-vias can be filled with dimples of less than 5µm and overfill of less than 3µm. Plates surface features with excellent coplanarity and measured R-values below 2µm. Trace profile of traces plated is less than 15%. Process quality is ensured with CVS analysis and control of additives. Can be used in combination with Systek semi-additive and embedded trace technologies.

MacDermid Alpha Electronics Solutions

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