MacuSpec HT 300 is a high-throwing power DC acid copper for metallization of through-holes of 15:1 aspect ratio boards at production volumes.
Reportedly offers micro-distribution at high current densities, while avoiding capital expense of pulse plating rectifiers. Is for through-hole plating, conformal blind via plating, and pattern plating applications. Is analyzable by CVS and common analytical tools. Deposit exceeds copper metallization specifications required for multilayer PCBs, including IPC TM-650, 2.4.18. Tensile strength is greater than 36,000psi and elongation greater than 12%.
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