Celsius Thermal Solver combines finite element analysis for solid structures with computational fluid dynamics for fluids to enable complete system analysis in a single tool.
In conjunction with Clarity 3D Solver, Voltus IC Power Integrity and Sigrity technology for PCB and IC packaging, engineering teams can combine electrical and thermal analysis and simulate the flow of both electricity and heat for a more accurate system-level thermal simulation. Performs static (steady-state) and dynamic (transient) electrical-thermal cosimulations based on actual flow of electrical power in advanced 3-D structures, providing visibility into real-world system behavior. Accurately simulates large systems with detailed granularity for any object of interest. Models structures as small as the IC and its power distribution together with structures as large as the chassis.