SIwave v4.0 is capable of broadband signal- and power-integrity analyses along with DC voltage and current analysis for complete boards and packages. According to Ansys, SIwave v4.0 has the ability to couple board and package electromagnetic fields with HFSS(TM) technology for complete system-level simulation. Enhanced GUI aids component management and allows simultaneous analyses and dynamic zooming. Software includes automated error checking and geometry correction and allows native merging of packages to boards.
Version 4.0 includes new features for signal-integrity, power-integrity and electromagnetic compatibility testing, providing accurate solutions beyond 10 Gb/s. Links to other products can enable accurate characterization of additional heating due to copper-resistive losses that have previously been estimated or ignored completely.
This latest release includes multiple automation enhancements that ease design flows by removing manual manipulations. Automated error checking and geometry correction have been implemented. Schematic creation, transient and QuickEye analyses setups have been automated for circuit simulation driven by electromagnetics when using SIwave with Ansoft Designer.
Ucamco introduces UCAM v 8.4.1, the latest version of its PCB CAM software. UCAM v 8.4.1 supports multitasking 64-bit Windows software, and users can simultaneously run several programs on the same workstation. Features include a faster, more intuitive link the Integr8tor, the company’s sales tool, and menu-driven automation provides complete control and single-click operation without the need for special programming. Support for ODB++ v7 allows UCAM to link seamlessly to other CAM and assembly programs. One-click functions allow users to remove unused innerlayer pads, set special clearances for fiducial pads and optimize track runs on flexible circuits.
Fujipoly Zebra Gold 8000 Series elastomeric connectors provide excellent board-to-component electrical contact for broad-ranging commercial and military applications.
The connector delivers a high current carrying capacity of 250-500 mA amps per wire while exhibiting an electrical resistance of only 25-50milliohms. The Zebra® 8000 Series connector is constructed from a low durometer silicone core that is covered with parallel rows of flat, gold-plated conductors ranging from 100 to 166 wires per inch. These unique design and performance characteristics allow the interconnect device to accommodate pad spacing as close as .020” centers.
Intercept Technology Inc. introduces the Xtent Technology Rules Editor, available in version 4.0 Mozaix and 6.0 Pantheon.
Xtent provides rules management and high-speed constraint options in an interactive, multifunctional data flow passed in full to and from the Mozaix schematic and Pantheon layout.
The integrated application gives users access to quick creation, manipulation and assignment of design rules and constraints. Features include a spreadsheet format, providing visual previews for layer stackup and padstack construction, as well as color-coded highlights to indicate rule or constraint violations and changes in layer rules.
RF-, high-speed- and hybrid-specific design flows are available in both standard Pantheon and Mozaix applications, allowing flexibility to specialized design environments at or above any software package available in the market.
Xtent has two high-speed constraint options, signal path class and signal path, licensed separately for high-speed design environments. The specialized design flow has the ability to define signal path, net or pin-to-pin length constraints using formulas and functions. In addition, signal path objects are able to be auto-defined through user-specified pattern criteria.
SiSoft has introduced an educational area on its Web site to provide information on high-speed design.
The SiSoft's eLearning site provides online educational and reference materials for high-speed system designers and signal integrity specialists including technical papers, app notes, Webinars and videos.
Douglas Electrical Components, Inc. introduced a new solution for hermetically sealing a variety of circuit board styles, including flex, rigid and hybrid circuits. According to the company, the system is ideal for high-volume applications with certain space constraints or weight requirements. These hermetically sealed circuit boards allow for increased conductor density, while providing a smaller, lighter and less expensive solution.
By sealing directly to the circuit as opposed to each wire, the Douglas Electrical Components solution can either increase the number of conductors used in the same size housing or reduce the size of the housing for the same conductor count. The method takes advantage of a low-cost circuit board manufacturing process making the solution more cost-effective than wire feedthrough.
Additionally, by sealing directly to the circuit board, electrical connection points can be eliminated, which minimizes voltage drops and any associated labor needed to make and test the wire-to-circuit connection point.
