A prototyping peripheral add-on board for NanoBoard FPGA-based development boards works with the fixed-FPGA NanoBoard 3000 and NanoBoard NB2. Comes in packs of three or 20. Reportedly eliminates need to create custom PCBs for circuit prototyping. A single on-board connector plugs into the NanoBoard to give direct access to the I/O on the host NanoBoard FPGA and common NanoBoard resources, including power and JTAG lines. Can integrate custom circuitry with standard NanoBoard peripherals and services, using the land patterns and plated hole connections on the prototyping boards to construct custom hardware. Supports a variety of surface mount packages in varying pitches, as well as through-hole components on 0.1" or 0.05" grids. Predefined land patterns for SMD accommodate pitches of 0.5, 0.65, 0.8 and 1.27 mm; each SMD pad is connected to a 0.5 mm hole. Board identification is achieved using a 1-wire compatible unique ID device.
 
Altium Ltd., www.altium.com

Elpemer RC 2054 HR is a photoimageable, aqueous-alkaline developable 1-pack etch resist said to offer resolution up to 25 µm. Reportedly is fast drying, with low exposure energy and short stripping times. Can be applied by roller coating, curtain coating or dipping. It is free of filling agents and pigments.

Lackwerke Peters, www.peters.de

 

 

 

BM10 series FPC-to-board connectors are RoHS-compliant and halogen-free. Are available with stacking heights of 0.6 and 0.8 mm; feature 2.98 mm depth and 0.4 mm contact pitch. For use in printers, industrial controls, medical and instrumentation equipment, and multimedia devices. The 40-position connectors feature enhanced self-alignment mechanism via guidance ribs, with a self-alignment range of 0.3 mm. Have metal fittings and a clipping contact design.

Hirose Electric Co. Ltd., www.hiroseusa.com 

EP2 Enhanced Polyimide is a filled product with copper adhesion superior to traditional polyimides. Is said to reduces water absorption,
(by 25%) increase thermal conductivity and reduce CTE while maintaining the full 250°C Tg of polyimide for thermal stability through process and application. Reduces cure cycle by 25 - 50%. Z-axis expansion is 0.65% at 50° to 260°C, copper peel is 25% higher than traditional unfilled polyimides, and Td (5%) is 424°C compared to traditional polyimides. Meets IPC-4101/40 and 41. Non-MDA chemistry resists drill fracturing. Is compatible with lead-free solder processing. Meets NASA outgassing and UL-V0 flammability requirements. Is RoHS and WEEE compliant.

Arlon, www.arlon-med.com