Printed Circuit Design & Fab Online Magazine - Current

Products

PowerDC Thermal software works in concert with the PowerDC Electrical simulation software as an integrated thermal/electrical analysis environment for IC packages and printed circuit boards. Is said to eliminate manual iterations between simulations with separate electrical and thermal tools, reduce time and improve results convergence. Considers both die heating and copper heating on package and board, and takes into account temperature and location dependencies. Considers factors such as increasing electrical resistance at higher operating temperatures. Results are said to accurately reflect the impact of increasing component power dissipation as temperatures rise. Imports design files from all popular PCB and IC package layout systems. Performs analysis on partially or fully placed and routed designs. Account for complex plane shapes, including cut-outs, wires, solder balls, solder bumps, and via structures to maximize accuracy.

Sigrity Inc., www.sigrity.com

No. 991 is an electrically heated 350°F bench oven used for heating parts, including those with emissions of flammable solvents. Workspace dimensions are 28" x 24" x 18". 4KW are installed in Nichrome wire elements. Features 2" insulated walls, leg support stand, Type 304, 2B finish stainless steel interior and exterior of brushed #4 stainless steel. Two oven shelves are included.

The Grieve Corp., www.grievecorp.com

Searay high-density open pin field arrays provide maximum grounding and routing flexibility with signal integrity optimized Edge Rate contacts. Seventeen standard board stack heights, new right angle designs and press fit tail options are now available as standards.

Samtec, www.samtec.com

Sudden Circuits are configurable, high-speed flex circuit data links that provide millions of design permutations. Design permutations include connector, pitch, gender, orientation, number of positions, length (up to 16.3"), signal mapping, and customer-specified signal/ground assignments. Connector end terminations include Q Series, Q2, Edge Rate, and micro and standard pitch strips up to 0.100" pitch. Can be created using Solutionator online design/build program.

Samtec, www.samtec.com

Studio Suite v. 2010 contains multiple solution options within a single design environment. Incorporates an asymptotic solver is based on the Shooting Bouncing Ray method, an extension to physical optics, capable of tackling simulations with an electric size of many thousands of wavelengths such as radar cross-section analysis. MWS’ frequency domain solver now includes third and mixed order elements for simulation efficiency and speed. Time domain solver includes functional enhancements such as arbitrary order dispersive material modeling, and domain decomposition for cluster computing, also in combination with GPU computing. Integrates Microstripes, for EMC simulations.

Computer Simulation Technology, cst.com

Multisim 11 circuit simulation software delivers a graphical approach that abstracts the complexities of traditional circuit simulation. The academic edition incorporates specialized teaching features and is complemented by textbooks and courseware. Has interactive components, simulation-driven instruments and integration to real-world analog and digital measurements. Can be combined with NI Ultiboard 11 layout and routing software, and integrated with NI LabVIEW measurement software. Exports raw VHDL from a programmable logic device schematic; has AC single-frequency analysis. Multisim 11 Professional includes SPICE parser improvements, updated BSIM models, support for advanced parameters and enhanced digital simulation accuracy; has WYSIWYG net naming system.

National Instruments, www.ni.com/multisim/upgrade