Pallamerse SMT 2000 electroless palladium final finish is for use in ENEPIG (electroless nickel electroless palladium immersion gold) processes for both SMT and gold wire bonding assembly applications. Has lower gold content, yet sustains uniform gold thickness distribution and reliable solderability with reduced gold consumption.

Dow Electronic Materials, www.dow.com

 

 

 

Copper Gleam HV-101 and HVS-202 acid copper provide high plating efficiency for vertical continuous plating applications. MV-100 acid copper exhibits exceptionally good metal distribution and better performance for vertical in-line equipment and is said to improve cycle time.

Circuposit 3350-1 electroless copper offers plating coverage and reliability, stable operation, and reduced chemical consumption and waste generation for MLB (Multi-Layer Board) and HDI applications. Circuposit 7800 desmear is for semi-additive processes and is said to offer uniform and stable adhesion promotion treatment and reliable via bottom cleaning. Reportedly provides excellent plating coverage, high peel strength and reliability. Circuposit 3323A Conditioner is a biodegradable conditioner for plated-through hole processes, offers excellent coverage and lower surface tension.

Dow Electronic Materials, www.dow.com

Microfill EVF Via Fill is said to enhance via filling at low surface thicknesses and is capable of simultaneous through-hole plating. Is suitable for HDI and IC substrate applications.

Dow Electronic Materials, www.dow.com

Technistan Ag high speed tin-silver alloy electroplating process for use in electronic connector and component applications. Is said to produce a SnAg5 bright electrodeposit at current densities of up to 300 ASF / 30 ASD. Is also capable of producing other SnAg alloy compositions, depending on application. For semiconductor components, connectors and other applications.

Technic, www.technic.com