Products

Studio Suite v. 2010 contains multiple solution options within a single design environment. Incorporates an asymptotic solver is based on the Shooting Bouncing Ray method, an extension to physical optics, capable of tackling simulations with an electric size of many thousands of wavelengths such as radar cross-section analysis. MWS’ frequency domain solver now includes third and mixed order elements for simulation efficiency and speed. Time domain solver includes functional enhancements such as arbitrary order dispersive material modeling, and domain decomposition for cluster computing, also in combination with GPU computing. Integrates Microstripes, for EMC simulations.

Computer Simulation Technology, cst.com 

Multisim 11 circuit simulation software delivers a graphical approach that abstracts the complexities of traditional circuit simulation. The academic edition incorporates specialized teaching features and is complemented by textbooks and courseware. Has interactive components, simulation-driven instruments and integration to real-world analog and digital measurements. Can be combined with NI Ultiboard 11 layout and routing software, and integrated with NI LabVIEW measurement software. Exports raw VHDL from a programmable logic device schematic; has AC single-frequency analysis. Multisim 11 Professional includes SPICE parser improvements, updated BSIM models, support for advanced parameters and enhanced digital simulation accuracy; has WYSIWYG net naming system. 
 
National Instruments, www.ni.com/multisim/upgrade

 

No. 977 is an electrically heated 500ºF universal-style oven used to preheat racks of small circuit boards. Workspace dimensions measure 30" x 40" x 31". 9KW are installed in Nichrome wire heating elements, while a 600 CFM, 1/2 HP recirculating blower motor provides front-to-rear universal airflow. Features 4" thick insulated walls, Type 304, 2B finish stainless steel interior and aluminized steel exterior. Is equipped with four drawers, each 24" x 30" x 2" and rated for 50 lbs. loading. Has digital temperature controller, manual reset excess temperature controller with separate contactors and recirculating blower airflow safety switch. 

The Grieve Corp., www.grievecorp.com

SlimStack board-to-board connectors have 0.40 mm pitch, 0.70 mm mated height and 2.60 mm width. Reportedly offer about 25% space savings compared to many competitive 0.40 mm pitch types. Features include two-point contact design and 0.18 mm wipe length; nickel-barrier plating; tactile click sound and feel, and gold-plated terminals. Are available in 20 - 50 circuits and have four solder tabs on each mating side. System is rated at 50V and 0.3A.
 
Molex Inc., www.molex.com/product/bb/slimstack04mm.html

 

The Fine Silver Conductor Trial Kit is capable of producing fine lines down to 80 µm using a set of screen printers and a thermal oven. Provides a solution to overcome challenges with fine polymer thick film circuits and functional printable and flexible electronics. Includes silver ink, flexible substrates and a processing manual with circuit samples. Is possible to generate 100 µm fine silver conductor traces on flexible substrates. Includes 100 g of silver ink, flexible film substrates with special treatments, a processing manual, MSDS and examples of finished flexible circuits.
 
DKN Research, www.dknresearch.com

 

MicroLine 1000 E UV laser system is for separating thin or flexible assembled and unassembled panels.

Read more: LPKF Introduces MicroLine 1000 E UV Laser System

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