Ansoft Designer 6.0 Solver on Demand technology analyzes signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment. Can access field and circuit simulation tools while designing electronic packages and PCBs early in the design cycle. Integrates HFSS 3-D electromagnetic field simulation software and HSPICE IC simulation. Can predict how high-frequency electromagnetic components affect ICs. Provides user interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye and VerifEye convolution and statistical eye analysis, as well as IBIS-AMI technology.

ANSYS, Inc., www.ansys.com

IsoStack free software tool is for PCB stackup design. Saves design files locally or shares via email in standard formats. Includes up-to-date database of globally available constructions and electrical data on high-speed digital Isola materials. Built-in pressed thickness calculator offers automatic design checks for hybrid builds and warnings for insufficient prepreg and glass stop. Features equation-based calculators for targeting desired impedance. Is available online in beta version.

Isola, www.isola-group.com/isodesign/

Fusion3D laser, for laser-direct structuring, has upgraded revised optics and laser control. Reportedly cuts structuring times for 3D circuit boards 10% to 20%, depending on component layout. Includes improvements on laser head.

LPKF Laser & Electronics AG, http://www.lpkfusa.com/images/fusion3d

Cable Studio and Microwave Studio TLM solver are integrated in Studio Suite 2011. Is a single unified environment for all EMC-related modeling tasks, including simplified model setup and simulation. MWS TLM solver (Microstripes) and CS provide features for real-world EMC analysis, including coupled simulations that enable large system analysis and installed performance studies. In preprocessing, performs definition of compact equivalent aperture models and cable harnesses. Enhances coupling between the electromagnetic field and cable solvers to enable direct transient simulation of susceptibility problems in systems containing complex cable bundles, including shielded twisted pair circuits.

Computer Simulation Technology, www.cst.com